MASM 2013 Call for Papers

Posted on 2013/03/20. Filed under: 綜合 |

The MASM conference will be fully contained within WSC 13.

9th International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) 2013

The 2013 International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) aims to again be a forum for the exchange of ideas and best practices between researchers and practitioners from around the world involved in modeling and analysis of high-tech manufacturing systems. We are convinced of the worth and importance of the continuation of the MASM events held in Tempe, Arizona in 2000 and 2002, Singapore in 2005, Miami, Florida in 2008, Austin, Texas in 2009, Baltimore, Maryland in 2010, Phoenix, Arizona in 2011, and Berlin, Germany in 2012.

The MASM 2013 conference will be fully contained within the Winter Simulation Conference 2013 (WSC 2013), the leading conference in discrete event simulation. WSC 2013 features a comprehensive program ranging from introductory tutorials to state-of-the-art research and practice. WSC 2013 will take place in Washington, DC, USA. All attendees of the MASM conference will register for WSC 2013 at the same cost. All participants of WSC 2013 can attend MASM 2013 sessions.

We are looking for high-quality research at all levels of semiconductor manufacturing. At the operational level, improved equipment and process control and optimized scheduling and material handling system policies must be studied. At the tactical level, better capacity planning and qualification management are expected. At the strategic level, demand planning, factory economics and supply chain efficiency must be improved to support the business. Moreover, better integration of decisions taken at the three decisions levels is becoming a must. We are also looking for papers with a focus on the sustainability of the semiconductor manufacturing facilities and the supply chain. Topics may include the development of policies to reduce electricity and water consumption in wafer manufacturing, the metrics to measure the impact of carbon footprint reductions on the global supply chain, the integration of renewable technology in the fab, etc. These various goals will be attained through new advanced control and statistical methods, and operations research and simulation methods. We invite participants to present on all topics related to modeling and analysis that will help address these challenges. While the MASM conference is mostly focused on the current semiconductor industry state-of-the-art, neither presenters nor attendees need to be in the IC industry to participate. We are interested in any methodologies, research, and/or applications from other related industries such as TFT-LCD, flexible displays, bio-chip, solid state lighting (LED) and photovoltaic (PV) that might also share or want to share common and new practices.

The conference includes tutorials and related software demonstrations within the Winter Simulation Conference 2013. A broad range of papers is sought, including theoretical developments, applied research, and case studies. Interested individuals within academia, government agencies, equipment suppliers, manufacturers, students, contractors, and other interested parties are encouraged to participate.

Conference Location: MASM 2013 will be held in Washington, DC, at the J.W. Marriott Hotel. Located on Pennsylvania Avenue, this luxury hotel is near the White House, National Theatre and the National Portrait Gallery. It is located just 20 minutes from Reagan National Airport. WSC’13 will provide an opportunity to visit the Smithsonian, Pentagon, monuments on the Mall, numerous museums and even the cathedral-like Metro stations.

Conference Organizers:

Galliam Claude Yugma, Ecole des Mines de Saint-Etienne (France), Claude.Yugma

Jesus A. Jimenez, Texas State University-San Marcos, San Marcos Texas (USA), jj30

International Program Committee:

  • Guy Curry, Texas A&M University, USA
  • Stephane Dauzere-Peres, Ecole des Mines de Saint-Etienne, France
  • Hans Ehm, Infineon Technologies AG, Germany
  • Kenneth Fordyce, IBM, USA
  • John Fowler, Arizona State University, USA
  • Cathal Heavey, University of Limerick, Ireland
  • Makoto Hirayama, State University of New York at Albany, USA
  • DJ Kim, Micron, USA
  • Tae-Eog Lee, KAIST, South Korea
  • Lars Mönch, University of Hagen, Germany
  • Oliver Rose, Universität der Bundeswehr München, Germany
  • Israel Tirkel, Ben-Gurion University, Israel
  • Gerald Weigert, Dresden University of Technology, Germany

Paper Submission:

Please follow the WSC 2013 Author Kit to prepare your MASM 2013 paper at http://www.wintersim.org.

Important Dates:

Deadline for Paper Submission: April 1st 2013

Notification of Acceptance: June 3rd 2013

Camera Ready Paper due: July 15th 2013

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